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S70FS01GSDSBHV210 - Infineon

Description: FLASH - NOR Memory IC 1Gbit SPI - Quad I/O 80 MHz 24-BGA (8x6)

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S70FS01GSDSBHV210 - Infineon PCB footprint - BGA - BGA - 24-ball FBGA 8.0 x 6.0 X 1.2 mm (ZSA024)
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S70FS01GSDSBHV210 - Infineon  - 3D model - BGA - 24-ball FBGA 8.0 x 6.0 X 1.2 mm (ZSA024)
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S70FS01GSDSBHV210 Details

  • Manufacturer Part Number:

    S70FS01GSDSBHV210

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Additional Feature:

    IT ALSO HAS X1 MEMORY WIDTH

  • Alternate Memory Width:

    2

  • Clock Frequency-Max (fCLK):

    80 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    4

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX4

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

S70FS01GSDSBHV210 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout and thermal management guide in their application note AN2014-01. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
  • Infineon provides a component selection guide in their application note AN2014-01. Additionally, the datasheet provides recommended values for external components. It's crucial to follow these guidelines to ensure the device operates within its specifications.
  • The input and output capacitors should be selected based on their voltage rating, capacitance value, and ESR (Equivalent Series Resistance). Infineon recommends using capacitors with a voltage rating of at least 1.5 times the maximum input voltage, and an ESR of less than 10 mohm. The datasheet provides recommended capacitance values and ESR ranges.
  • The S70FS01GSDSBHV210 requires a specific power-up sequence to ensure proper initialization. The datasheet provides a detailed power-up sequence diagram, which should be followed to prevent damage or malfunction.
  • The datasheet provides thermal limitations, derating factors, and a thermal model for the device. The maximum allowed junction temperature can be calculated using the thermal model and the device's power dissipation. It's essential to ensure the device operates within its thermal specifications to prevent overheating and damage.

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