Infineon provides a recommended PCB layout in the application note AN2019-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
Infineon recommends using a gate driver with a minimum output current of 2A and a maximum output voltage of 20V to ensure proper switching of the IGBT. The driver should also be compatible with the module's input voltage and frequency requirements.
The maximum allowed overcurrent is 2x the nominal current (Ic) for a maximum of 10ms, and the maximum allowed overvoltage is 1.5x the nominal voltage (Vce) for a maximum of 10ms. Exceeding these limits can damage the module.
Infineon recommends using a heat sink with a thermal resistance of ≤ 0.5 K/W and ensuring good thermal contact between the module and heat sink. Additionally, a thermal interface material (TIM) with a thermal conductivity of ≥ 1 W/mK should be used.
The module should be stored in a dry, clean environment with a temperature range of -40°C to 125°C. It should be handled with care to avoid mechanical stress, and electrostatic discharge (ESD) precautions should be taken to prevent damage.
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