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S8040RTP - LITTELFUSE

Description: SCR 800 V 40 A Standard Recovery Through Hole TO-220AB-R

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Symbol
S8040RTP - LITTELFUSE - PCB symbol
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PCB Footprints
S8040RTP - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB (R-Package)
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3D Models
S8040RTP - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220AB (R-Package)
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S8040RTP Details

  • Manufacturer Part Number:

    S8040RTP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.43

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    475 V/us

  • DC Gate Trigger Current-Max:

    40 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    3 mA

  • Non-Repetitive Pk On-state Cur:

    520 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    25000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    40 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S8040RTP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a large copper area connected to the thermal pad of the device to dissipate heat efficiently. A minimum of 1 oz copper thickness and a thermal relief pattern around the thermal pad are also recommended.
  • Littelfuse recommends using a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. The device should be soldered using a solder with a melting point of 217°C (423°F) or higher.
  • The S8040RTP has a maximum surge current rating of 100 A for 8/20 μs waveform, as per IEC 61000-4-5. However, this rating may vary depending on the specific application and environmental conditions.
  • Yes, the S8040RTP can be used in high-frequency applications up to 1 GHz. However, the device's performance may degrade at higher frequencies due to parasitic inductance and capacitance. Littelfuse recommends consulting the device's S-parameters and performing simulations to ensure optimal performance.
  • Yes, the S8040RTP is compatible with lead-free soldering processes. Littelfuse ensures that the device meets the requirements of the RoHS (Restriction of Hazardous Substances) directive.

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S8040RTP Overview

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