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S8055RTP - LITTELFUSE

Description: LITTELFUSE - S8055RTP - Thyristor, 800 V, 40 mA, 35 A, 55 A, TO-220AB, 3 Pins

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Symbol
S8055RTP - LITTELFUSE - PCB symbol
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PCB Footprints
S8055RTP - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB (R-Package)
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3D Models
S8055RTP - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220AB (R-Package)
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S8055RTP Details

  • Manufacturer Part Number:

    S8055RTP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.43

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    475 V/us

  • DC Gate Trigger Current-Max:

    40 mA

  • DC Gate Trigger Voltage-Max:

    1.5 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    3 mA

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    650 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    35000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    55 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SCR

S8055RTP Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper pad underneath the device, with multiple vias connecting to a solid ground plane on the bottom layer. This helps to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the component.
  • The S8055RTP can withstand surge currents up to 100A for 10ms, but it's recommended to consult the datasheet for specific surge current ratings and to design the circuit to minimize surge currents.
  • While the S8055RTP is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100kHz. However, the device's performance may degrade at higher frequencies, and additional filtering or shielding may be required.
  • To select the correct fuse rating, consider the maximum current and voltage ratings of your circuit, as well as the desired response time and fault-clearing characteristics. Consult the datasheet and application notes for guidance on selecting the appropriate fuse rating.

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S8055RTP Overview

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