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S8065J - LITTELFUSE

Description: SCRs S8065J

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S8065J - LITTELFUSE  - 3D model
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S8065J Details

  • Manufacturer Part Number:

    S8065J

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-218

  • Package Description:

    ROHS COMPLIANT, PLASTIC, TO-218X, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    250 V/us

  • DC Gate Trigger Current-Max:

    50 mA

  • DC Gate Trigger Voltage-Max:

    2 V

  • Holding Current-Max:

    80 mA

  • JEDEC-95 Code:

    TO-218

  • JESD-30 Code:

    R-PSFM-D3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Moisture Sensitivity Level:

    2

  • Non-Repetitive Pk On-state Cur:

    950 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    65000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    65 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    800 V

  • Repetitive Peak Reverse Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    SOLDER LUG

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SCR

S8065J Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can also improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, ensuring good thermal management, such as using a heat sink or thermal interface material, can help to reduce the junction temperature and prevent thermal runaway.
  • For high-reliability applications, it is crucial to follow the recommended operating conditions, including voltage, current, and temperature ratings. Additionally, ensuring proper PCB design, component selection, and manufacturing processes can help to minimize the risk of failure. It is also recommended to perform thorough testing and validation to ensure the device meets the required reliability standards.
  • To handle the high inrush current during power-on, it is recommended to use a soft-start circuit or an inrush current limiter to reduce the stress on the device and the power supply. Additionally, ensuring that the power supply can handle the high inrush current and using a suitable fuse or overcurrent protection can also help to prevent damage to the device.
  • To ensure ESD protection for the S8065J, it is recommended to follow proper handling and storage procedures, such as using ESD-safe packaging and handling the device with ESD-protected tools. Additionally, incorporating ESD protection devices, such as TVS diodes or ESD arrays, in the circuit design can help to protect the device from ESD events.

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S8065J Overview

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