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S912ZVMC25F1WKK - NXP

Description: 16-bit Microcontrollers - MCU MagniV 16-bit MCU, S12Z core, 256KB Flash, 50MHz, -40/+150degC, Automotive Qualified, 80LQFP-EP

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PCB Footprints
S912ZVMC25F1WKK - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - lqfp80
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3D Models
S912ZVMC25F1WKK - NXP  - 3D model - Quad Flat Packages - lqfp80
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S912ZVMC25F1WKK Details

  • Manufacturer Part Number:

    S912ZVMC25F1WKK

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-80

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • Has ADC:

    NO

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    S912

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G80

  • Length:

    12 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    80

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP80,.55SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    32768

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Speed:

    50 MHz

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    3.5 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

S912ZVMC25F1WKK Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S912ZVMC25F1WKK is -40°C to 125°C, with a maximum junction temperature of 150°C.
  • The clock settings for the S912ZVMC25F1WKK can be configured using the Clock Controller (CLK) module. The CLK module allows you to select the clock source, configure the clock frequency, and enable/disable clock outputs. Refer to the device's reference manual for detailed instructions.
  • The maximum current draw for the S912ZVMC25F1WKK depends on the operating frequency and voltage. At 1.2V and 100MHz, the maximum current draw is approximately 350mA. However, this value can vary depending on the specific use case and peripheral usage.
  • The S912ZVMC25F1WKK supports secure boot through the BootROM and the Security Controller (SCC) module. To implement secure boot, you need to generate a secure boot image, configure the BootROM to use the secure boot image, and enable the SCC module to authenticate the boot process.
  • The main difference between the S912ZVMC25F1WKK and the S912ZVMC25F1WKH is the package type. The S912ZVMC25F1WKK comes in a 196-pin LFBGA package, while the S912ZVMC25F1WKH comes in a 196-pin MAPBGA package. Both devices have the same functionality and performance.

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S912ZVMC25F1WKK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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