S9S08QD4J1MSCR - NXP

S9S08QD4J1MSCR Details

• Manufacturer Part Number:

  S9S08QD4J1MSCR

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  SOIC-8

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  3

• Has ADC:

  YES

• Bit Size:

  8

• Boundary Scan:

  YES

• Clock Frequency-Max:

  5 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• JESD-30 Code:

  R-PDSO-G8

• JESD-609 Code:

  e3

• Length:

  4.9 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  6

• Number of Terminals:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SOP

• Package Equivalence Code:

  SOP8,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  256

• ROM (words):

  4096

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.75 mm

• Speed:

  16 MHz

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  2.7 V

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  3.9 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER