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S9S12DT12F1MPVE - NXP

Description: IC MCU

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PCB Footprints
S9S12DT12F1MPVE - NXP PCB footprint - Other - Other - QFP65P2200X2200X160-112N
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3D Models
S9S12DT12F1MPVE - NXP  - 3D model - Other - QFP65P2200X2200X160-112N
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S9S12DT12F1MPVE Details

  • Manufacturer Part Number:

    S9S12DT12F1MPVE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LQFP-112

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    NO

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    S12

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G112

  • Length:

    20 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    112

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP112,.87SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Speed:

    25 MHz

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

S9S12DT12F1MPVE Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the S9S12DT12F1MPVE is -40°C to 125°C, but it's recommended to operate within -20°C to 85°C for optimal performance and reliability.
  • The internal oscillator can be configured using the OSCCTL register. Set the OSCCTL[OSCCLKS] bit to 1 to enable the internal oscillator, and adjust the OSCCTL[OSCCLKR] bits to select the desired frequency (e.g., 4 MHz, 8 MHz, or 16 MHz).
  • The maximum current consumption of the S9S12DT12F1MPVE depends on the operating frequency and voltage. At 16 MHz and 5V, the maximum current consumption is approximately 25 mA. However, this value can be reduced by using power-saving modes and optimizing the system design.
  • The S9S12DT12F1MPVE has a built-in watchdog timer (WDT) that can be enabled and configured using the WDTCTL register. Set the WDTCTL[WDTEN] bit to 1 to enable the WDT, and adjust the WDTCTL[WDTPR] bits to set the timeout period (e.g., 128 ms, 256 ms, or 512 ms).
  • Yes, the S9S12DT12F1MPVE can be used with an external crystal oscillator. Connect the crystal oscillator to the XTAL and EXTAL pins, and configure the OSCCTL register to select the external oscillator as the clock source.

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S9S12DT12F1MPVE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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