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SA5.0ARLG - onsemi

Description: 500 Watt Peak Power MiniMOSORB Zener Transient Voltage Suppressors

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SA5.0ARLG - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD CASE 59AA-01 ISSUE A
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3D Models
SA5.0ARLG - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - AXIAL LEAD CASE 59AA-01 ISSUE A
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SA5.0ARLG Details

  • Manufacturer Part Number:

    SA5.0ARLG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-204AC

  • Package Description:

    LEAD FREE, PLASTIC, CASE 59AA-01, SIMILAR TO DO-204AC, MINIMOSORB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    59AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    7 V

  • Breakdown Voltage-Min:

    6.4 V

  • Breakdown Voltage-Nom:

    6.7 V

  • Case Connection:

    ISOLATED

  • Clamping Voltage-Max:

    9.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    NO

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

SA5.0ARLG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a heat sink or thermal interface material, and ensure good airflow. Consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • Use a soldering temperature of 260°C (500°F) for 10-15 seconds, with a peak temperature of 240°C (464°F) for 5-10 seconds. Ensure a soldering iron with a temperature control system is used.
  • Use an ESD wrist strap or mat, and ensure all equipment is grounded. Handle the device by the body or pins, avoiding direct contact with the die. Use ESD-sensitive packaging and storage materials.
  • Store the device in a dry, cool place (20°C to 30°C or 68°F to 86°F) with relative humidity below 60%. Avoid exposure to direct sunlight, moisture, and contaminants.

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SA5.0ARLG Overview

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