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SAK-TC356TA-64F300SAB - Infineon

Description: -40°C - +125°C, 300 MHz, 3.3Vto5V PG-LFBGA-180 Package

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PCB Footprints
SAK-TC356TA-64F300SAB - Infineon PCB footprint - BGA - BGA - PG-LFBGA-180
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3D Models
SAK-TC356TA-64F300SAB - Infineon  - 3D model - BGA - PG-LFBGA-180
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SAK-TC356TA-64F300SAB Details

  • Manufacturer Part Number:

    SAK-TC356TA-64F300SAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA-180

  • HTS Code:

    8542.31.00.25

  • Date Of Intro:

    2020-01-02

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Has ADC:

    YES

  • Additional Feature:

    ALSO AVAILABLE WITH 5 V NOMINAL

  • Bit Size:

    32

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B180

  • JESD-609 Code:

    e4

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    180

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Speed:

    300 MHz

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

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SAK-TC356TA-64F300SAB Overview

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