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SB05-03Q-TL-E - onsemi

Description: Low forward voltage (VF max=0.55V); Fast reverse recovery time (trr max=10ns); Low switching noise; Low leakage current and high reliability due to highly reliable planar structure; Small-sized package, permitting SB05-03Q-applied sets to be compact and slim

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PCB Footprints
SB05-03Q-TL-E - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - MCP
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SB05-03Q-TL-E - onsemi  - 3D model - SO Transistor Flat Lead - MCP
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SB05-03Q-TL-E Details

  • Manufacturer Part Number:

    SB05-03Q-TL-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 / MCP3

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    419AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.08

  • Additional Feature:

    HIGH RELIABILITY, LOW LEAKAGE CURRENT

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    3 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    30 µA

  • Reverse Recovery Time-Max:

    0.01 µs

  • Reverse Test Voltage:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SB05-03Q-TL-E Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, avoid overheating, and follow the recommended operating temperature range (-40°C to 150°C). Also, consider derating the device's power handling at higher temperatures.
  • Handle the device with ESD-protective equipment and follow standard ESD handling procedures. The device has built-in ESD protection, but it's not a substitute for proper handling and storage.
  • Yes, the SB05-03Q-TL-E is AEC-Q101 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and guidelines for your specific application.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check the device's datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.

Trust Checks

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SB05-03Q-TL-E Overview

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