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SB2150-AP - MCC

Description: Diode 150 V 2A Through Hole DO-15

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Symbol
SB2150-AP - MCC - PCB symbol
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PCB Footprints
SB2150-AP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-15
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3D Models
SB2150-AP - MCC - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-15
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SB2150-AP Details

  • Manufacturer Part Number:

    SB2150-AP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.84

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    10 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    5

SB2150-AP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces as short as possible and use a common mode choke to reduce EMI.
  • Monitor the input voltage, output current, and junction temperature to ensure they are within the specified limits. Use a thermal management system to keep the junction temperature below 150°C.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the VIN pin as possible, to filter out high-frequency noise and reduce voltage ripple.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common mode choke to reduce EMI. Ensure the input and output cables are properly shielded and routed away from each other.
  • The maximum allowed voltage drop is 0.5V. Exceeding this limit may reduce the converter's efficiency and reliability.

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SB2150-AP Overview

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SB2150-AP Alternates

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Part Image SB2150TR Fagor Electrónica

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For a full list of alternate parts for SB2150-AP, check out Findchips.com