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SB3100-T - Diodes Incorporated

Description: Diodes Inc SB3100-T, Schottky Diode, 100V 3A, 2-Pin DO-201AD

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SB3100-T - Diodes Incorporated - PCB symbol
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PCB Footprints
SB3100-T - Diodes Incorporated PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-201AD
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SB3100-T - Diodes Incorporated - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-201AD
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SB3100-T Details

  • Manufacturer Part Number:

    SB3100-T

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-201AD

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.79 V

  • JEDEC-95 Code:

    DO-201AD

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SB3100-T Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently.
  • To ensure proper biasing, follow the recommended application circuit in the datasheet, and ensure the input voltage is within the specified range. Also, ensure the output capacitor is properly sized to maintain stability.
  • Key considerations for EMI filtering include using a common-mode choke, adding a ferrite bead to the input, and ensuring the output capacitor is properly decoupled. Additionally, consider using a shielded inductor and keeping the layout compact to minimize radiated emissions.
  • To troubleshoot issues, start by verifying the input voltage and output voltage are within the specified range. Check the PCB layout for any signs of thermal stress or electrical noise. Use an oscilloscope to inspect the output waveform and look for signs of oscillation or ringing. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the SB3100-T at high ambient temperatures can reduce its reliability and lifespan. Ensure the device is properly heat-sinked, and consider using a thermal interface material to improve heat transfer. Derate the device's power rating according to the datasheet's thermal derating curve.

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SB3100-T Overview

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