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SB3229-E1 - onsemi

Description: Obsolete - Preconfigured DSP System for Hearing Aids, with up to 4 WDRC channels

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PCB Footprints
SB3229-E1 - onsemi PCB footprint - Other - Other - SIP25, 5.59x3.18 CASE 127DN ISSUE A
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3D Models
SB3229-E1 - onsemi  - 3D model - Other - SIP25, 5.59x3.18 CASE 127DN ISSUE A
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SB3229-E1 Details

  • Manufacturer Part Number:

    SB3229-E1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SIP-25

  • Package Description:

    PAD-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    127DN

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    SEATED HGT-NOM

  • JESD-30 Code:

    R-XXMA-N25

  • Length:

    5.59 mm

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    1.525 mm

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UNSPECIFIED

  • Width:

    3.81 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

SB3229-E1 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SB3229-E1 is -40°C to 125°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and ensure the input voltage is within the specified range (typically 4.5V to 5.5V).
  • The maximum allowable power dissipation for the SB3229-E1 is typically around 1.5W, but this can vary depending on the specific application and operating conditions.
  • To prevent electrostatic discharge (ESD) damage, handle the SB3229-E1 with an anti-static wrist strap or mat, and ensure the workspace is ESD-protected. Follow proper handling and storage procedures outlined in the datasheet.
  • When designing a PCB with the SB3229-E1, ensure proper thermal management, minimize trace lengths and widths, and follow recommended layout guidelines to minimize noise and interference.

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SB3229-E1 Overview

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