Diodes Incorporated recommends a PCB layout with a thermal pad connected to a large copper area on the top and bottom layers to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current. Additionally, ensure good thermal management, and consider using a heat sink if necessary.
The maximum allowed voltage stress on the SB340-T during reverse recovery is 1.5 times the rated voltage (Vr). Exceeding this limit may cause device failure.
Yes, the SB340-T can be used in a parallel configuration to increase current handling. However, it's essential to ensure that the devices are matched for voltage and current ratings, and that the PCB layout is designed to minimize current imbalance and thermal mismatch.
Diodes Incorporated recommends storing the SB340-T in a dry, cool place with a temperature range of -40°C to 30°C and humidity below 60%. Avoid storing the devices in direct sunlight or near heat sources.
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