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SBAS16XV2T5G - onsemi

Description: Lead Finish: 100% Matte Sn (Tin); Qualified Reflow Temperature: 260°C; Extremely Small SOD-523 Package; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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PCB Footprints
SBAS16XV2T5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-523 CASE 502
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3D Models
SBAS16XV2T5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-523 CASE 502
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SBAS16XV2T5G Details

  • Manufacturer Part Number:

    SBAS16XV2T5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523-2

  • Package Description:

    SOD-523, 2 PIN

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-08-20

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    100 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.006 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SBAS16XV2T5G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering, as they can cause damage to the device.
  • Use ESD-sensitive handling procedures, such as grounding wrist straps and using ESD-protective packaging. The device has built-in ESD protection, but external protection is still recommended to prevent damage.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. The recommended capacitance values are 10uF for input and 22uF for output. Ensure the capacitors are placed close to the device's pins.

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SBAS16XV2T5G Overview

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Part Image BAS16XV2T5G onsemi

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