Description:Extremely Fast Switching Speed; Low Forward Voltage − 0.35 Volts (Typ) @ IF = 10 mAdc; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable
HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, CASE 463-01, SC-75, 3 PIN
Pin Count:
3
Manufacturer Package Code:
463-01
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.70
Manufacturer:
onsemi
YTEOL:
6
Application:
FAST RECOVERY
Breakdown Voltage-Min:
30 V
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.24 V
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
0.6 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
0.1 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Power Dissipation-Max:
0.225 W
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
30 V
Reverse Current-Max:
2 µA
Reverse Recovery Time-Max:
0.005 µs
Reverse Test Voltage:
25 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
SBAT54CTT1G Frequently Asked Questions (FAQs)
A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a thermal relief pattern on the top layer, and a solid copper pour on the bottom layer connected to the thermal pad. This helps to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and consider derating the device's power dissipation accordingly. Additionally, ensure good thermal management, such as using a heat sink or thermal interface material, and follow proper PCB design and assembly guidelines.
The recommended soldering conditions for the SBAT54CTT1G are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering temperature profile that follows the IPC/JEDEC J-STD-020 standard.
To handle ESD protection during handling and assembly, follow proper ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Ensure that the device is stored in its original packaging or an ESD-safe container when not in use.
The SBAT54CTT1G has an MSL rating of 3, which means it can be exposed to a maximum of 168 hours of moisture before soldering. This requires proper storage and handling procedures to prevent moisture absorption, and baking the devices according to the manufacturer's guidelines if they are exposed to moisture for an extended period.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SBAT54CTT1G Overview
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