Description:Medium Speed Switching Times; Low Leakage Current Applications; Available in 8 mm Tape and Reel - Use BAV199LT1 to order the 7 inch/3,000 unit reel; Pb-Free Package is Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable
HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN
Pin Count:
3
Manufacturer Package Code:
318
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.70
Factory Lead Time:
10 Weeks
Manufacturer:
onsemi
YTEOL:
6.1
Additional Feature:
LOW LEAKAGE CURRENT
Application:
GENERAL PURPOSE
Breakdown Voltage-Min:
70 V
Configuration:
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.9 V
JEDEC-95 Code:
TO-236AA
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
2 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-65 °C
Output Current-Max:
0.215 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power Dissipation-Max:
0.225 W
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
70 V
Reverse Current-Max:
5000 µA
Reverse Recovery Time-Max:
3 µs
Reverse Test Voltage:
70 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
SBAV199LT3G Frequently Asked Questions (FAQs)
A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the package to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate heat sinking and airflow around the device.
The SBAV199LT3G has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
Yes, the SBAV199LT3G is suitable for high-reliability and automotive applications, as it meets the relevant industry standards, such as AEC-Q101, and has been designed and tested to ensure high reliability and robustness.
The recommended soldering and assembly techniques for the SBAV199LT3G include using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended reflow soldering profile to prevent thermal damage.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SBAV199LT3G Overview
Use the download button to access the SBAV199LT3G schematic symbol, PCB footprint, and 3D model.
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