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SBAW56LT1G - onsemi

Description: Pb-Free Packages are Available; S & SSV1 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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Symbol
SBAW56LT1G - onsemi - PCB symbol
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PCB Footprints
SBAW56LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
SBAW56LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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SBAW56LT1G Details

  • Manufacturer Part Number:

    SBAW56LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.715 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Recovery Time-Max:

    0.006 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SBAW56LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SBAW56LT1G involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 10uF capacitor to ground. The input voltage should be within the recommended range (1.8V to 5.5V). Additionally, ensure the input signal is within the specified common-mode voltage range.
  • The SBAW56LT1G can operate up to 100 MHz, but the maximum operating frequency depends on the specific application and the quality of the PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • The SBAW56LT1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded during handling.
  • The SBAW56LT1G has a thermal pad on the bottom of the package. To ensure proper thermal management, use a thermal interface material (TIM) between the thermal pad and the PCB, and design the PCB to allow for good airflow around the device.

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SBAW56LT1G Overview

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