The recommended PCB footprint for the SBLB25L30CT-E3/45 is a rectangular pad with dimensions of 5.5 mm x 3.5 mm, with a thermal pad of 2.5 mm x 2.5 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) thermal pad.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air soldering technique to solder the component.
The maximum allowed voltage derating for the SBLB25L30CT-E3/45 is 80% of the rated voltage, which is 25 V. Therefore, the maximum allowed voltage derating is 20 V.
The SBLB25L30CT-E3/45 is rated for operation up to 150°C. However, it's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet to ensure reliable operation.
Handle the SBLB25L30CT-E3/45 with care to avoid mechanical stress, bending, or twisting. Store the components in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the components to extreme temperatures, humidity, or vibration during shipping.
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SBLB25L30CT-E3/45 Overview
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