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SC18IM700IPW,128 - NXP

Description: NXP - SC18IM700IPW,128 - UART Interface, 1 Channel, 460.8 Kbps, 2.4 V, 3.6 V, TSSOP, 16 Pins

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SC18IM700IPW,128 - NXP - PCB symbol
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PCB Footprints
SC18IM700IPW,128 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP16 (SOT403-1)
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3D Models
SC18IM700IPW,128 - NXP - 3D model - Small Outline Packages - TSSOP16 (SOT403-1)
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SC18IM700IPW,128 Details

  • Manufacturer Part Number:

    SC18IM700IPW,128

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT403-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bus Compatibility:

    I2C, UART

  • Clock Frequency-Max:

    0.4 MHz

  • Data Transfer Rate-Max:

    0.05 MBps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, I2C

SC18IM700IPW,128 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for analog and digital grounds.
  • Use a reliable communication protocol like UART, SPI, or I2C, and ensure proper signal termination, clock synchronization, and data validation. Implement error detection and correction mechanisms, and consider using a checksum or CRC for data integrity.
  • The SC18IM700IPW,128 has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Consider thermal interface materials and thermal vias on the PCB to improve heat dissipation.
  • Use an external power-on reset circuit or a dedicated reset IC to ensure a clean power-up sequence. Implement a brown-out detection circuit to detect voltage drops and reset the device if necessary. Consider using a voltage supervisor IC for this purpose.
  • Use ESD protection diodes or TVS diodes on the I/O lines to protect against electrostatic discharge. Ensure that the PCB design includes ESD protection features, such as ESD-resistant components and a Faraday cage around sensitive areas.

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SC18IM700IPW,128 Overview

Use the download button to access the SC18IM700IPW,128 schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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