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SC18IM704PWJ - NXP

Description: UART Interface IC Master I2C-bus controller with UART interface

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SC18IM704PWJ - NXP - PCB symbol
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PCB Footprints
SC18IM704PWJ - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP16 (SOT403-1)
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3D Models
SC18IM704PWJ - NXP - 3D model - Small Outline Packages - TSSOP16 (SOT403-1)
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SC18IM704PWJ Details

  • Manufacturer Part Number:

    SC18IM704PWJ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Bus Compatibility:

    I2C, UART

  • Clock Frequency-Max:

    0.4 MHz

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, I2C

SC18IM704PWJ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for analog and digital grounds.
  • Use shielded cables, implement proper grounding and earthing, and consider using isolation techniques such as optocouplers or isolation transformers. Also, ensure proper termination and impedance matching.
  • Ensure good airflow around the device, use a heat sink if necessary, and consider using thermal interface materials. Also, follow the recommended operating temperature range and thermal design guidelines.
  • Use a logic analyzer or oscilloscope to monitor signals, check the device's status registers, and verify the configuration and programming. Also, consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, follow the recommended firmware development guidelines, use the provided software development kits (SDKs) and libraries, and ensure proper handling of interrupts, buffers, and data transmission protocols.

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SC18IM704PWJ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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