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SC18IS600IBS,128 - NXP

Description: NXP - SC18IS600IBS,128 - Interface Bridges, I2C to SPI, 2.4 V, 3.6 V, HVQFN, 24 Pins, -40 °C

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PCB Footprints
SC18IS600IBS,128 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT616-3
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3D Models
SC18IS600IBS,128 - NXP  - 3D model - Quad Flat No-Lead - SOT616-3
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SC18IS600IBS,128 Details

  • Manufacturer Part Number:

    SC18IS600IBS,128

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    SOT616-3

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bus Compatibility:

    I2C

  • Clock Frequency-Max:

    18 MHz

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    16 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, I2C

SC18IS600IBS,128 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a reliable clock source, ensure proper termination of the I2S bus, and implement error checking and correction mechanisms in your firmware. Also, ensure that the master clock frequency is within the recommended range.
  • The SC18IS600IBS,128 has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the I2S bus lines and other sensitive inputs. Ensure that the PCB design includes ESD protection measures, and handle the device with ESD-safe equipment and procedures.
  • Power up the device in the following sequence: VDD, VDDA, and then the clock signal. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.

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SC18IS600IBS,128 Overview

Use the download button to access the SC18IS600IBS,128 schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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