SC18IS602BIPW,112 - NXP

SC18IS602BIPW,112 Details

• Manufacturer Part Number:

  SC18IS602BIPW,112

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  TSSOP

• Package Description:

  4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16

• Pin Count:

  16

• Manufacturer Package Code:

  SOT403-1

• ECCN Code:

  EAR99

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Address Bus Width:

  3

• Bus Compatibility:

  I2C

• Clock Frequency-Max:

  18 MHz

• Data Transfer Rate-Max:

  0.225 MBps

• JESD-30 Code:

  R-PDSO-G16

• JESD-609 Code:

  e4

• Length:

  5 mm

• Moisture Sensitivity Level:

  1

• Number of Terminals:

  16

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP16,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.1 mm

• Supply Current-Max:

  16 mA

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  2.4 V

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  4.4 mm

• uPs/uCs/Peripheral ICs Type:

  BUS CONTROLLER, I2C