Murata recommends a symmetrical layout with the device at the center, and a solid ground plane on the bottom layer to minimize noise and radiation. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
Murata recommends using a 10uF capacitor in parallel with a 100nF capacitor between the VCC and GND pins, and placing them as close to the device as possible. Additionally, a 1uF capacitor can be used between the VCC and GND pins for additional decoupling.
The SCA3100-D07-1 is rated for operation from -40°C to +85°C, but it's recommended to derate the operating temperature range based on the specific application and environmental conditions.
The SCA3100-D07-1 is a moisture-sensitive device, and it's recommended to store it in a dry environment with a relative humidity below 60%. If the device is exposed to moisture, it's recommended to bake it in a dry environment at 125°C for 24 hours before use.
Murata recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 3-5 minutes. The device should be cooled down to below 100°C within 10 minutes after reflow.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
SCA3100-D07-1 Overview
Use the download button to access the SCA3100-D07-1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SCA31,
or try a keyword search, such as Other Sensors/Transducers
About Murata Electronics
Murata Manufacturing Co., Ltd. is a Japanese multinational company that specializes in the design, manufacturing, and sale of electronic components and solutions.
Murata offers a wide range of electronic components and modules that are used in various industries and applications. Some of their key product categories include: capacitors, inductors, resistors, sensors, rf components and modules, and power devices.
