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SCH3114I-NU - Microchip

Description: Microchip SCH3114I-NU, Input Output Controller, IDE, PCI, ACPI, DMA, 128-Pin VTQFP

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SCH3114I-NU - Microchip - PCB symbol
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PCB Footprints
SCH3114I-NU - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - mo-128vtqfp
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SCH3114I-NU - Microchip - 3D model - Quad Flat Packages - mo-128vtqfp
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SCH3114I-NU Details

  • Manufacturer Part Number:

    SCH3114I-NU

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    VTQFP-128

  • Pin Count:

    128

  • Manufacturer Package Code:

    TQFP-128

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Address Bus Width:

    4

  • Boundary Scan:

    NO

  • Bus Compatibility:

    LPC

  • External Data Bus Width:

    4

  • JESD-30 Code:

    S-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Number of I/O Lines:

    46

  • Number of Terminals:

    128

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP128,.63SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Qualification Status:

    Not Qualified

  • RAM (words):

    256

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MULTIFUNCTION PERIPHERAL

SCH3114I-NU Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current specifications. Use a reliable power supply, and consider using thermal management techniques such as heat sinks or thermal interfaces to maintain a stable temperature.
  • Use a metal shield or a shielded enclosure to minimize EMI and RFI emissions. Ensure that the device is placed at least 1 mm away from any metal objects, and use a ground plane to reduce radiation.
  • The POR and BOR features are enabled by default. Ensure that the power supply is stable and within the recommended voltage range to prevent unwanted resets. Use an external reset circuit or a supervisory IC to monitor the power supply and generate a reset signal if necessary.
  • Use a high-quality clock source with a stable frequency and amplitude. Ensure that the clock signal is properly terminated, and use a clock buffer or repeater if necessary to maintain signal integrity.

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SCH3114I-NU Overview

Use the download button to access the SCH3114I-NU schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SCH31, or try a keyword search, such as Multifunction Peripherals

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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