ROHM provides a recommended PCB layout in their application note AN191, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
The SCS230AE2GC11 has a high power dissipation, so proper thermal management is crucial. ROHM recommends using a heat sink with a thermal resistance of 10°C/W or less, and ensuring good airflow around the device. Additionally, the PCB should be designed with thermal vias and a solid ground plane to help dissipate heat.
While the datasheet specifies an operating temperature range of -40°C to 125°C, ROHM recommends derating the device's power dissipation above 85°C to ensure reliable operation. It's essential to consider the device's thermal characteristics and design the system accordingly.
To ensure EMC, ROHM recommends following proper PCB design practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components as necessary. Additionally, the device's switching frequency should be considered when designing the system to minimize electromagnetic interference (EMI).
ROHM recommends using low-ESR capacitors with a capacitance value of 10uF to 22uF for the input and output capacitors. The capacitor selection should be based on the specific application requirements, such as ripple current, voltage rating, and temperature range.
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