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SCS312AMC - ROHM Semiconductor

Description: Diode 650 V 12A Through Hole TO-220FM

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PCB Footprints
SCS312AMC - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220FM (2PIN)
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3D Models
SCS312AMC - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220FM (2PIN)
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SCS312AMC Details

  • Manufacturer Part Number:

    SCS312AMC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-220FM, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2018-06-18

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    PD-CASE

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    650 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    96 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    36 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    60 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SCS312AMC Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
  • ROHM recommends using a ceramic capacitor with a value of 10uF to 22uF, and an X7R or X5R dielectric, as close to the VIN pin as possible. This helps to filter out noise and ensure stable operation.
  • Yes, the SCS312AMC is suitable for battery-powered devices due to its low quiescent current (IQ) of 1.5mA. However, it's essential to consider the overall system power consumption, battery life, and charging requirements to ensure efficient operation.
  • To troubleshoot issues with the SCS312AMC, start by verifying the input voltage, output voltage, and current consumption. Check for proper PCB layout, thermal management, and component selection. Use an oscilloscope to monitor the output voltage and current waveforms. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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