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SCT4013DW7TL - ROHM Semiconductor

Description: 750V, 13mΩ, 7-pin SMD, Trench-structure, Silicon-carbide(SiC) power MOSFET

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PCB Footprints
SCT4013DW7TL - ROHM Semiconductor PCB footprint - Other - Other - TO-263-7L_Nominal_Height
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3D Models
SCT4013DW7TL - ROHM Semiconductor  - 3D model - Other - TO-263-7L_Nominal_Height
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SCT4013DW7TL Details

  • Manufacturer Part Number:

    SCT4013DW7TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    27 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    750 V

  • Drain Current-Max (ID):

    98 A

  • Drain-source On Resistance-Max:

    0.0169 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JEDEC-95 Code:

    TO-263

  • JESD-30 Code:

    R-PSSO-G7

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    7

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    267 W

  • Pulsed Drain Current-Max (IDM):

    233 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

SCT4013DW7TL Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power dissipation according to the ambient temperature.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. Consult the ROHM soldering guide for more details.
  • Yes, the SCT4013DW7TL is designed to withstand vibrations up to 10G. However, ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. The SCT4013DW7TL has an internal ESD protection diode, but external ESD protection devices may be necessary depending on the application.

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SCT4013DW7TL Overview

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