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SD-2011 - Nidec Copal

Description: Dip Switch BCD 10 Position Through Hole, Right Angle Rotary for Tool Actuator 100mA 5VDC

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PCB Footprints
SD-2011 - Nidec Copal PCB footprint - Other - Other - SD-2011-2
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3D Models
SD-2011 - Nidec Copal  - 3D model - Other - SD-2011-2
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SD-2011 Details

  • Manufacturer Part Number:

    SD-2011

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.90.20

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Nidec Copal Electronics Corporation

  • YTEOL:

    8

  • Actuator Color:

    YELLOW

  • Actuator Material:

    POLYAMIDE

  • Actuator Type:

    ROTARY SCREW

  • Additional Feature:

    LOW PROFILE

  • Body Breadth:

    6.8 mm

  • Body Height:

    10 mm

  • Body Length or Diameter:

    10 mm

  • Center Contact Material:

    COPPER ALLOY

  • Center Contact Plating:

    GOLD

  • Contact Current(DC)-Max:

    0.1 A

  • Contact (DC) Max Rating R Load:

    .1A@5VDC

  • Contact Resistance:

    0.1 mΩ

  • Contact Voltage(DC)-Max:

    5 V

  • Dielectric Withstand Volts:

    250VAC V

  • Electrical Life:

    20000 Cycle(s)

  • End Contact Material:

    COPPER ALLOY

  • End Contact Plating:

    GOLD

  • Housing Material:

    POLYPHENYLENE SULPHIDE

  • Indexing Angle:

    36 deg

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Material:

    POLYPHENYLENE SULPHIDE

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT-RIGHT ANGLE

  • Number of Positions:

    10

  • Number of Switch Sections:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BAG

  • Surface Mount:

    NO

  • Switch Action:

    LATCHED

  • Switch Type:

    ROTARY CODED SWITCH

  • Terminal Finish:

    GOLD

  • Terminal Material:

    COPPER ALLOY

  • Termination Type:

    SOLDER

SD-2011 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer, connected to the thermal pad of the SD-2011, and to use thermal vias to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good airflow, and consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The recommended soldering conditions for the SD-2011 are a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering iron temperature of 350°C or less.
  • To prevent damage, store the SD-2011 in its original packaging, avoid exposing it to moisture, and handle it with anti-static wrist straps or mats to prevent electrostatic discharge.
  • The recommended testing and inspection procedures for the SD-2011 include visual inspection, solderability testing, and functional testing to ensure the device meets the specified electrical characteristics.

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SD-2011 Overview

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