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SDINBDG4-16G-XA - SanDisk

Description: eMMC 16GB iNAND 7250 eMMC 5.1 -40C to 85C

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PCB Footprints
SDINBDG4-16G-XA - SanDisk PCB footprint - BGA - BGA - 153-pin bga
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3D Models
SDINBDG4-16G-XA - SanDisk  - 3D model - BGA - 153-pin bga
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SDINBDG4-16G-XA Details

  • Manufacturer Part Number:

    SDINBDG4-16G-XA

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    VFBGA-153

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    SanDisk Corporation

  • Clock Frequency-Max (fCLK):

    200 MHz

  • Data Retention Time-Min:

    15

  • Endurance:

    3000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B153

  • Length:

    13 mm

  • Memory Density:

    137438953472 bit

  • Memory IC Type:

    eMMC

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    17179869184 words

  • Number of Words Code:

    16000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Organization:

    16GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA153,14X14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    EMMC 5.1

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    MLC NAND TYPE

  • Width:

    11.5 mm

SDINBDG4-16G-XA Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SDINBDG4-16G-XA is -25°C to 85°C.
  • To ensure data integrity and prevent data corruption, use a secure erase command, implement wear leveling, and use error correction codes (ECC) to detect and correct errors.
  • The SDINBDG4-16G-XA supports up to 3,000 write cycles per block, with a total of 4,096 blocks.
  • To optimize performance, use a high-speed interface (e.g., UHS-I), optimize file system and cluster size, and use parallel processing to reduce write latency.
  • The SDINBDG4-16G-XA is compatible with most operating systems and devices that support SD cards, including Windows, macOS, Linux, and Android. However, it's recommended to check compatibility with your specific device or system.

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SDINBDG4-16G-XA Overview

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