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SDM20U40Q-13 - Diodes Incorporated

Description: SURFACE MOUNT SCHOTTKY BARRIER DIODE

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PCB Footprints
SDM20U40Q-13 - Diodes Incorporated PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD523 height 0.65
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3D Models
SDM20U40Q-13 - Diodes Incorporated  - 3D model - Small Outline Diode Flat Lead - SOD523 height 0.65
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SDM20U40Q-13 Details

  • Manufacturer Part Number:

    SDM20U40Q-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-523, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.15 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.01 µs

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SDM20U40Q-13 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
  • Handle the device with an anti-static wrist strap or mat. Ensure the PCB is designed with ESD protection in mind, including TVS diodes and resistors. Follow standard ESD handling procedures.
  • Yes, but ensure you follow the recommended operating conditions, and consider additional testing and validation for high-reliability or automotive applications. Consult with Diodes Incorporated for specific guidance.
  • Optimize the system design for low voltage and low current operation. Use a low-dropout regulator, and consider using a power gating technique to reduce power consumption during idle periods.

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SDM20U40Q-13 Overview

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