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SDM2U30CSP-7 - Diodes Incorporated

Description: Diode Schottky 30V 2A 2-Pin X3-WLP T/R

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PCB Footprints
SDM2U30CSP-7 - Diodes Incorporated PCB footprint - Other - Other - X3-WLB1608-2
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3D Models
SDM2U30CSP-7 - Diodes Incorporated  - 3D model - Other - X3-WLB1608-2
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SDM2U30CSP-7 Details

  • Manufacturer Part Number:

    SDM2U30CSP-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    X3-WLB1608-2, CSP-2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.48 V

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    20 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    150 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SDM2U30CSP-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SDM2U30CSP-7 is a 2.5mm x 2.5mm pad with a 1.5mm x 1.5mm thermal pad in the center, and a 0.5mm keep-out zone around the device.
  • To ensure reliable operation in high-temperature environments, ensure proper thermal management by providing a heat sink or thermal pad, and follow the recommended PCB layout and thermal design guidelines.
  • The maximum allowed voltage on the input pins of SDM2U30CSP-7 is 5.5V, exceeding which may cause permanent damage to the device.
  • Yes, SDM2U30CSP-7 can be used in switching regulator applications, but ensure that the device is properly bypassed and decoupled to minimize voltage transients and noise.
  • To handle ESD protection for SDM2U30CSP-7, follow proper handling and storage procedures, and consider adding external ESD protection devices or using ESD-protected ICs in the design.

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SDM2U30CSP-7 Overview

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