- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SDR0603-1R5ML
- Part Number SDR0603-1R5ML
- Manufacturer Bourns
- Pin Count 2
- Part Category Inductor
- Package Category Other
- Footprint Name Other - SDR0603-2R5ML-3
- Released Date Mar 11, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SDR0603-1R5ML Details
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Manufacturer Part Number:
SDR0603-1R5ML
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
12 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
7
SDR0603-1R5ML Frequently Asked Questions (FAQs)
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The recommended land pattern for SDR0603-1R5ML is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.1 mm from the component body.
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The SDR0603-1R5ML is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for specific derating information and ensure that the component is suitable for your application's temperature range.
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Handle the SDR0603-1R5ML by the body, avoiding touching the leads or the resistor element. Use anti-static precautions, such as an ESD wrist strap or mat, to prevent electrostatic discharge damage. Avoid bending or flexing the leads, and ensure that the component is properly seated on the PCB during assembly.
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The SDR0603-1R5ML is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, the component is designed to meet the requirements of IPC/JEDEC J-STD-020, which includes humidity testing. If your application requires high humidity resistance, consider using a hermetically sealed resistor or a component with a higher humidity rating.
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The recommended soldering profile for SDR0603-1R5ML is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The component should be soldered using a solder with a melting point of 180-220°C. Consult the datasheet for specific soldering profile recommendations and ensure that your assembly process meets these requirements.
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SDR0603-1R5ML Overview
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