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SDR0604-331KL - Bourns

Description: Bourns SDR0604 Series Type 0604 Wire-wound SMD Inductor with a Ferrite Core, 330 μH ±10% Wire-Wound 360mA Idc Q:25

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Symbol
SDR0604-331KL - Bourns - PCB symbol
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PCB Footprints
SDR0604-331KL - Bourns PCB footprint - Other - Other - SDR0604-331KL-2
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3D Models
SDR0604-331KL - Bourns - 3D model - Other - SDR0604-331KL-2
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SDR0604-331KL Details

  • Manufacturer Part Number:

    SDR0604-331KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Construction:

    Cylindrical

  • Core Material:

    FERRITE

  • DC Resistance:

    2.25 Ω

  • Inductance-Nom (L):

    330 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Diameter:

    5.8 mm

  • Package Length:

    4.8 mm

  • Package Style:

    SMT

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Current-Max:

    0.27 A

  • Self Resonance Frequency:

    3 MHz

  • Shape/Size Description:

    CYLINDRICAL PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER NICKEL TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    10%

SDR0604-331KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SDR0604-331KL is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a thermal interface material (TIM) to improve heat transfer between the device and the PCB.
  • The maximum operating temperature range for the SDR0604-331KL is -40°C to +125°C, with a storage temperature range of -40°C to +150°C.
  • To ensure reliability in high-vibration applications, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material to reduce mechanical stress on the device.
  • The recommended soldering profile for the SDR0604-331KL is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/second.

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SDR0604-331KL Overview

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