The recommended land pattern for SDR0604-471KL is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure a good thermal connection to a large copper area on the PCB, and consider using thermal vias to dissipate heat. A thermal pad on the PCB is also recommended.
The maximum operating temperature for SDR0604-471KL is 125°C, with a derating of 1.5% per °C above 80°C.
Yes, SDR0604-471KL is designed to withstand high-vibration environments, with a vibration rating of 10-2000 Hz, 10 G peak acceleration.
To ensure reliability in a humid environment, apply a conformal coating to the PCB, and consider using a moisture-resistant coating on the SDR0604-471KL component.
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SDR0604-471KL Overview
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