SDR0604-8R2ML - Bourns

SDR0604-8R2ML Frequently Asked Questions (FAQs)

• What is the recommended land pattern for SDR0604-8R2ML?
  The recommended land pattern for SDR0604-8R2ML is a rectangular pad with a size of 1.2 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use the SDR0604-8R2ML in a high-temperature environment?
  The SDR0604-8R2ML is rated for operation up to 150°C, but it's recommended to derate the power rating at higher temperatures. Consult the datasheet for specific derating curves and consult with a Bourns representative for custom high-temperature applications.
• How do I handle the SDR0604-8R2ML during PCB assembly to prevent damage?
  Handle the SDR0604-8R2ML by the edges to prevent damage to the component. Avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat during assembly, and follow standard PCB assembly procedures.
• Can I use the SDR0604-8R2ML in a high-vibration environment?
  The SDR0604-8R2ML is designed to withstand moderate vibration, but it's recommended to consult with a Bourns representative for custom vibration testing and to ensure the component meets the specific requirements of your application.
• What is the recommended soldering profile for SDR0604-8R2ML?
  The recommended soldering profile for SDR0604-8R2ML is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Consult the datasheet for specific soldering profile recommendations and consult with a Bourns representative for custom soldering profile requirements.