SDR0805-122KL footprint, schematic symbol and 3D model by Bourns

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SDR0805-122KL Details

The recommended land pattern for the SDR0805-122KL is a rectangular pad with a size of 1.2 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2 mm from the component body.
The SDR0805-122KL is rated for operation up to 150°C, but it's recommended to derate the component's power rating according to the temperature derating curve provided in the datasheet. Additionally, ensure that the component is properly soldered and the PCB is designed to withstand the high-temperature environment.
Handle the SDR0805-122KL by the edges or the body, avoiding touching the component's leads or pads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Ensure that the component is properly seated and aligned during PCB assembly to prevent mechanical stress.
The recommended soldering profile for the SDR0805-122KL is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the recommended temperature range and time to prevent damage to the component.
The SDR0805-122KL is not hermetically sealed, so it's not recommended for use in humid or moist environments. If exposure to moisture is unavoidable, ensure that the component is properly sealed or coated to prevent moisture ingress.

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