SDR0805-391KL - Bourns

SDR0805-391KL Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the SDR0805-391KL?
  The recommended land pattern for the SDR0805-391KL is a rectangular pad with a size of 1.2 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use the SDR0805-391KL in a high-temperature environment?
  The SDR0805-391KL is rated for operation up to 125°C, but it's recommended to derate the current rating at higher temperatures. Consult the datasheet for specific derating curves and consult with a Bourns representative for custom high-temperature applications.
• How do I handle the SDR0805-391KL during PCB assembly to prevent damage?
  Handle the SDR0805-391KL by the edges or the body, avoiding touching the leads or the resistor element. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads during assembly.
• Can I use the SDR0805-391KL in a high-humidity environment?
  The SDR0805-391KL is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, it can be used in environments with moderate humidity levels (up to 60% RH) with proper PCB design and assembly practices.
• What is the recommended soldering profile for the SDR0805-391KL?
  The recommended soldering profile for the SDR0805-391KL is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Consult the datasheet for specific soldering profile recommendations and consult with a Bourns representative for custom soldering profiles.