SDR0805-5R6ML footprint, schematic symbol and 3D model by Bourns

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SDR0805-5R6ML Details

The recommended land pattern for the SDR0805-5R6ML is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, the SDR0805-5R6ML is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and reliability may degrade at extreme temperatures.
Yes, the SDR0805-5R6ML is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, the component's solderability may vary depending on the specific soldering process used.
The maximum current rating for the SDR0805-5R6ML is 1.5 A, based on a maximum operating temperature of 125°C. However, the actual current rating may vary depending on the specific application and operating conditions.
Yes, the SDR0805-5R6ML is suitable for high-frequency applications up to 1 GHz, due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, the component's performance may degrade at extremely high frequencies.

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