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SDR0805-6R8ML - Bourns

Description: Bourns SDR0805 Series Wire-wound SMD Inductor with a Ferrite Core, 6.8 μH ±20% 4.1A Idc Q:30

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Symbol
SDR0805-6R8ML - Bourns - PCB symbol
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PCB Footprints
SDR0805-6R8ML - Bourns PCB footprint - Other - Other - SDR0805-6R8ML-2
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3D Models
SDR0805-6R8ML - Bourns - 3D model - Other - SDR0805-6R8ML-2
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SDR0805-6R8ML Details

  • Manufacturer Part Number:

    SDR0805-6R8ML

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Case/Size Code:

    3131

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.04 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    5.3 mm

  • Package Length:

    7.8 mm

  • Package Style:

    SMT

  • Package Width:

    7.8 mm

  • Packing Method:

    TR, EMBOSSED PLASTIC/PAPER, 13 Inch

  • Rated Current-Max:

    3.2 A

  • Self Resonance Frequency:

    33 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Silver/Nickel/Tin (Ag/Ni/Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    20%

SDR0805-6R8ML Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SDR0805-6R8ML is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
  • The SDR0805-6R8ML is rated for operation up to 150°C, but it's recommended to derate the current rating at higher temperatures. Consult the datasheet for specific derating information.
  • Handle the SDR0805-6R8ML by the body, not the leads, to prevent damage. Avoid bending or flexing the leads, and use a pick-and-place machine or a vacuum pickup tool to minimize mechanical stress.
  • The recommended soldering profile for the SDR0805-6R8ML is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult the datasheet for a detailed soldering profile.
  • The SDR0805-6R8ML is designed to withstand moderate vibration, but it's recommended to secure the component to the PCB using a suitable adhesive or mechanical fastening method to prevent movement during vibration.

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SDR0805-6R8ML Overview

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