SDR0805-821KL - Bourns

SDR0805-821KL Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the SDR0805-821KL?
  The recommended land pattern for the SDR0805-821KL is a rectangular pad with a size of 1.2 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use the SDR0805-821KL in a high-temperature environment?
  The SDR0805-821KL is rated for operation up to 125°C, but it's recommended to derate the current rating by 1.5% per degree Celsius above 80°C to ensure reliable operation. It's also important to consider the PCB material and other component temperature ratings in the system.
• How do I handle the SDR0805-821KL during PCB assembly to prevent damage?
  To prevent damage, handle the SDR0805-821KL by the edges, avoid touching the component body, and use an anti-static wrist strap or mat. Also, ensure that the PCB is properly cleaned and dried before assembly to prevent moisture damage.
• What is the equivalent series resistance (ESR) of the SDR0805-821KL?
  The ESR of the SDR0805-821KL is not explicitly stated in the datasheet, but it's typically around 0.5 ohms to 1 ohm for this type of component. However, it's recommended to consult with Bourns Inc or a qualified engineer for specific ESR values and how they may affect the application.
• Can I use the SDR0805-821KL in a high-vibration environment?
  The SDR0805-821KL is designed to meet the vibration requirements of IEC 60068-2-6, but it's recommended to consult with Bourns Inc or a qualified engineer to ensure that the component can withstand the specific vibration requirements of the application.