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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SDR1005-1R0ML
- Part Number SDR1005-1R0ML
- Manufacturer Bourns
- Pin Count 2
- Last Modified Date Jun 7, 2022 11:45 PM UTC
- Pinout / Pin List Click Here (Member Only)
SDR1005-1R0ML Details
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Manufacturer Part Number:
SDR1005-1R0ML
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
14 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
7.4
SDR1005-1R0ML Frequently Asked Questions (FAQs)
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The recommended land pattern for the SDR1005-1R0ML can be found in the Bourns Application Note S-8151, which provides guidelines for PCB layout and land pattern design.
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The SDR1005-1R0ML has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad or heat sink can be used to dissipate heat, and the component should be placed in a well-ventilated area.
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The recommended soldering profile for the SDR1005-1R0ML is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. It's essential to follow the soldering profile to prevent damage to the component.
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Yes, the SDR1005-1R0ML is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or dislodging.
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To ensure the reliability of the SDR1005-1R0ML in high-humidity environments, it's essential to follow proper storage and handling procedures, including storing the components in a dry, cool place, and using a desiccant or nitrogen-filled packaging to prevent moisture absorption.
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SDR1005-1R0ML Overview
Use the download button to access the SDR1005-1R0ML 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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