SDR1005-3R3ML footprint, schematic symbol and 3D model by Bourns

Symbol

PCB Footprints

3D Models

SDR1005-3R3ML Details

The recommended land pattern for the SDR1005-3R3ML can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
The SDR1005-3R3ML has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management on the PCB. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
The recommended soldering profile for the SDR1005-3R3ML is a peak reflow temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. It's essential to follow the IPC J-STD-020 standard for soldering electronic components.
The SDR1005-3R3ML is a surface-mount device, and its reliability in high-vibration environments depends on the PCB design and assembly quality. It's recommended to follow the Bourns application note AN-13 for guidelines on PCB design and assembly to ensure reliable operation in high-vibration environments.
The SDR1005-3R3ML has a specified impedance tolerance of ±5%. To ensure the device meets this tolerance, it's essential to follow the recommended PCB layout and land pattern design guidelines, and to verify the impedance using a network analyzer or impedance analyzer.

Expert Contribution

System Verified

Community Approved

Use the download button to access the SDR1005-3R3ML schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like SDR10, or try a keyword search, such as Fixed Inductors

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →