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SDR1005-680KL - Bourns

Description: Bourns SDR1005 Series Wire-wound SMD Inductor with a Ferrite Core, 68 μH ±10% 1.4A Idc Q:24

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PCB Footprints
SDR1005-680KL - Bourns PCB footprint - Other - Other - SDR1005-680KL-1
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3D Models
SDR1005-680KL - Bourns  - 3D model - Other - SDR1005-680KL-1
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SDR1005-680KL Details

  • Manufacturer Part Number:

    SDR1005-680KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.9

  • Case/Size Code:

    5039

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.24 Ω

  • Inductance-Nom (L):

    68 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    5 mm

  • Package Length:

    12.7 mm

  • Package Style:

    SMT

  • Package Width:

    10 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    1.2 A

  • Self Resonance Frequency:

    11 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    COPPER TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    10%

SDR1005-680KL Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes. It's essential to follow these guidelines to ensure optimal performance, low inductance, and minimal parasitic effects.
  • To handle the high current rating, ensure your PCB design includes a robust power distribution network, adequate copper thickness, and sufficient thermal management. You may also need to consider heat sinks or thermal interfaces to prevent overheating.
  • To minimize EMI and RFI, use proper shielding, grounding, and filtering techniques in your design. Ensure the SDR1005-680KL is placed away from sensitive components and that the PCB layout is optimized for low radiation.
  • While the SDR1005-680KL has a high operating temperature range, it's essential to consider the derating curves and thermal management in your design. Ensure your system can maintain a safe operating temperature to prevent premature failure.
  • To ensure reliability and longevity, follow proper storage and handling procedures, avoid exceeding the recommended operating conditions, and implement adequate protection circuits to prevent overvoltage, overcurrent, and ESD events.

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SDR1005-680KL Overview

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