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SDR1030-470M - Bourns

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SDR1030-470M - Bourns  - 3D model
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SDR1030-470M Details

  • Manufacturer Part Number:

    SDR1030-470M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.2

  • Case/Size Code:

    3939

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.27 Ω

  • Inductance-Nom (L):

    47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3 mm

  • Package Length:

    10 mm

  • Package Style:

    SMT

  • Package Width:

    10 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    0.96 A

  • Self Resonance Frequency:

    14.2 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SDR1030-470M Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the SDR1030-470M would be to keep the component away from high-frequency signals, use a solid ground plane, and ensure that the input and output traces are well-separated to minimize coupling. Additionally, it's recommended to use a low-ESR capacitor for decoupling and to follow the manufacturer's recommended land pattern.
  • While the datasheet specifies an operating temperature range of -40°C to +125°C, it's essential to note that the component's performance may degrade at higher temperatures. Engineers should consider derating the component's specifications, such as the inductance and Q factor, when operating at elevated temperatures. Additionally, thermal management techniques, such as heat sinking or airflow, can help mitigate temperature-related issues.
  • While the SDR1030-470M is a high-quality component, it's essential to evaluate its suitability for high-reliability or safety-critical applications. Engineers should consider factors such as the component's failure rate, mean time between failures (MTBF), and compliance with relevant industry standards (e.g., AEC-Q200 for automotive applications). Additionally, it's recommended to consult with Bourns Inc or a qualified reliability engineer to determine the component's suitability for such applications.
  • The SDR1030-470M is designed to operate within specified voltage and current ratings. Exceeding these ratings can lead to component damage or failure. Engineers should ensure that the component is protected from overvoltage and overcurrent conditions through the use of voltage regulators, current limiters, or fuses. Additionally, it's recommended to follow the manufacturer's guidelines for handling and storage to prevent damage during manufacturing or transportation.
  • While the SDR1030-470M is specified for operation up to 100 MHz, it's possible to use it in higher-frequency applications with careful consideration. Engineers should evaluate the component's performance at higher frequencies, taking into account factors such as self-resonance, skin effect, and proximity effect. Additionally, it's recommended to consult with Bourns Inc or a qualified RF engineer to determine the component's suitability for high-frequency applications.

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SDR1030-470M Overview

Use the download button to access the SDR1030-470M 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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