SDR1806-330ML - Bourns

SDR1806-330ML Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SDR1806-330ML?
  The recommended PCB footprint for the SDR1806-330ML is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a minimum of 0.5 mm clearance around the component.
• How do I ensure reliable soldering of the SDR1806-330ML?
  To ensure reliable soldering of the SDR1806-330ML, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
• What is the maximum operating temperature range for the SDR1806-330ML?
  The maximum operating temperature range for the SDR1806-330ML is -40°C to 125°C. However, it's recommended to operate the component within a temperature range of -20°C to 85°C for optimal performance and reliability.
• Can I use the SDR1806-330ML in a high-vibration environment?
  Yes, the SDR1806-330ML is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
• Is the SDR1806-330ML compatible with lead-free soldering processes?
  Yes, the SDR1806-330ML is compatible with lead-free soldering processes. The component is designed to meet the requirements of the RoHS directive and can be soldered using lead-free solder alloys.