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SDR1806-470ML - Bourns

Description: Power inductor SMD 47uH 4.6A Bourns SDR1806 Series Wire-wound SMD Inductor with a Ferrite Core, 47 μH ±20% 4.6A Idc Q:22

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Symbol
SDR1806-470ML - Bourns - PCB symbol
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PCB Footprints
SDR1806-470ML - Bourns PCB footprint - Other - Other - SDR1806-470ML-1
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3D Models
SDR1806-470ML - Bourns - 3D model - Other - SDR1806-470ML-1
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SDR1806-470ML Details

  • Manufacturer Part Number:

    SDR1806-470ML

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.8

  • Case/Size Code:

    7255

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.095 Ω

  • Inductance-Nom (L):

    47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6.6 mm

  • Package Length:

    18.3 mm

  • Package Style:

    SMT

  • Package Width:

    14 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    2.5 A

  • Self Resonance Frequency:

    9 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    COPPER TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SDR1806-470ML Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SDR1806-470ML is a rectangular pad with a size of 1.8 mm x 0.6 mm, with a non-solder mask defined (NSMD) pad shape.
  • During reflow soldering, the SDR1806-470ML should be placed on a flat, even surface to prevent warping or damage. The recommended reflow profile is 260°C peak temperature, with a ramp-up rate of 3°C/s and a dwell time of 30-60 seconds.
  • The maximum operating temperature range for the SDR1806-470ML is -40°C to +125°C, with a derating of 1.5% per °C above 80°C.
  • The SDR1806-470ML should be stored in a dry, cool place, away from direct sunlight and moisture. If the component is exposed to moisture, it should be baked at 125°C for 24 hours to remove any absorbed moisture.
  • The recommended soldering method for the SDR1806-470ML is reflow soldering, using a solder paste with a melting point of 217°C to 220°C.

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SDR1806-470ML Overview

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