The recommended PCB footprint for the SDR1806-680ML is a rectangular pad with a size of 1.8 mm x 0.6 mm, with a 0.5 mm spacing between pads. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
To ensure the SDR1806-680ML operates within its specified temperature range, it's crucial to provide adequate heat dissipation. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the component. Additionally, avoid exceeding the maximum operating temperature of 125°C.
The recommended soldering profile for the SDR1806-680ML is a reflow soldering process with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/second. It's essential to follow this profile to prevent damage to the component.
While the SDR1806-680ML is a robust component, it's not designed for high-vibration environments. If your application involves high vibrations, consider using a component with specific vibration-resistant design features or additional mechanical support to ensure reliability.
To prevent damage, store the SDR1806-680ML in its original packaging or a similar ESD-protective package. Avoid exposing the component to moisture, extreme temperatures, or physical stress during shipping and storage.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SDR1806-680ML Overview
Use the download button to access the SDR1806-680ML schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SDR18,
or try a keyword search, such as Fixed Inductors
