The recommended land pattern for SDR1806-8R2ML is a rectangular pad with a size of 1.8 mm x 0.6 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While the SDR1806-8R2ML is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component doesn't exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
To prevent damage, handle the SDR1806-8R2ML by the edges, avoiding touching the component's surface or leads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Ensure the PCB is clean and dry before assembly, and follow proper soldering techniques.
The recommended soldering profile for SDR1806-8R2ML is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure the soldering process is within the component's specified temperature range to prevent damage.
While the SDR1806-8R2ML is designed to operate in a variety of environments, it's essential to consider the moisture sensitivity level (MSL) rating of 3, which means the component can withstand a maximum of 168 hours in a humid environment. Ensure proper sealing or conformal coating to protect the component from moisture.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
SDR1806-8R2ML Overview
Use the download button to access the SDR1806-8R2ML 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SDR18,
or try a keyword search, such as Fixed Inductors
